Products

Conveyor Oven

Conveyor Oven for LED Die Bond Baking

Application
Bake of LED Die Bond
Specification
Temp. Range
Max. 200°C (80~150°C±1°C in common use)
Mode of Air Supply
Air Flow at Left & Right sides
Conveying System
Conveys by Stainless Plates to guarantee a steady conveying speed & the magazine out of alignment under no circumstance
Baking Design
Simultaneous Baking at both Magazines
Maintenance Door
Top-Open Maintenance Door for easy cleaning of the furnance
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