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Solder Mask

Auto Rack-Type Hot-Air Conveyor Oven for Clean Room

Application

Advanced PCB Bake such as Bake of BGA、CSP、HDI、FLIP、CHIP at Clean Room Class-1000. The Latest Down Flow Design for use in Clean Room demonstrates High Temp. Uniformity.

Specification

Temp. Range

50~200°C

Mode of Air Supply

Vertical Down-flow

Conveying System

Chains

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Auto Rack-Type Hot-Air Conveyor Oven for Clean Room

.product-txt { line-height:20px;} Advanced PCB Bake such as Bake of BGA、CSP、HDI、FLIP、CHIP at Clean Room Class-1000. The Latest Down Flow Design for use in Clean Room demonstrates High Temp. Uniformity.

Note about cookies

Advanced PCB Bake such as Bake of BGA、CSP、HDI、FLIP、CHIP at Clean Room Class-1000. The Latest Down Flow Design for use in Clean Room demonstrates High Temp. Uniformity.